BareketAI moves power conversion from beside the processor to directly underneath it — delivering 1,000 amps through 1.5mm of PCB at 98% efficiency.
As AI GPUs cross 4kW, the horizontal copper path between the voltage regulator and the processor becomes the system-level bottleneck. BareketAI eliminates it.
Three world-class Israeli institutions. One continuous fabrication chain. No dependence on foreign foundries for the core device.
GaAs-on-SiC combines the electron mobility of gallium arsenide with the thermal conductivity of silicon carbide — a material pairing purpose-built for high-current vertical power delivery beneath the GPU die.
GanoSIC is designed for multi-market deployment from day one — the same vertical power architecture addresses AI infrastructure, automotive electrification, defense electronics, and RF power systems.
A GanoSIC device fabricated at GAL-EL, packaged at TAU Nano Center, and integrated on a PCB Technologies board is a complete Israeli-sourced compound semiconductor power module — no dependence on foreign foundries for the core device.
Each partner was chosen for a specific and irreplaceable capability. Together they form Israel's first complete GaAs-on-SiC semiconductor supply chain — from raw epitaxial wafer to working evaluation board.
The GPU power delivery problem is not a software problem, not an architecture problem, and not a cooling problem. It is a geometry problem — and it has a physical solution. When you move the voltage regulator from beside the chip to directly beneath it, the laws of physics do the rest.
Silicon power devices are approaching their material limits. GaN improved on silicon, but it inherits silicon's thermal constraints in vertical architectures. GaAs-on-SiC is the only material combination that simultaneously delivers the electron mobility needed for high-frequency switching and the thermal conductivity needed for vertical heat extraction in a 4kW GPU environment.
Israel has GAL-EL — the only compound semiconductor foundry in the country with decades of GaAs III-V expertise. It has TAU's world-class Nano Center. It has PCB Technologies, which builds HDI PCBs for IAI and Elbit. The complete supply chain already exists. GanoSIC is the product that connects it.
Whether you're a potential investor, technology partner, or institution interested in GanoSIC — we respond to all serious inquiries within 48 hours.
Full die specification shared only after NDA execution.